Columbia International
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- Chemical Reactors - (140)
- Coating and Deposition - (12)
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- Vacuum Equipments - (28)
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Coating & Deposition
Atomic Layer Deposition System ALD-MNT100
Specifications:
Coating area: ? 100mm ,or requested by customers
Substrate temperature: ? 500°C
Thickness uniformity: less than 1% for a 100mm-thick film
Carrier gas: Nitrogen or Argon
Precursor: Optional
Advantages:
Precise thickness control at atomic layer level
Excellent step coverage for materials such nano tube, fiber, pore arrays etc
Optimized designing to protect vacuum-sealing parts
All parts compatible with the requirements of semiconductor industry
Multiple deposition modes to choose for various requirements
Friendly interface for easy operation, all controlled by computer
Coating Materials:
Metal:Ru, Pt, W, Ni, Fe, ...
Nitrides:TiN,AlN,Zr3N4,Hf3N4,WN, ...
Oxides:HfO2,SiO2,ZnO,ZrO2,TiO2,Al2O3,La2O3,B2O3,Gd2O3, ...
Compounds:SrTiO3,BaxSr1-xTiO3(BST),PbZrxTi1-xO3(PZT),YBa2Cu3O7(YBCO),ITO, ...
Benchtop Sputter Coating System BSC-ETD2000
Feathers
Compact designing, benchtop sputtering system
Easy to read vacuum and current meters
Automatic controlling of vacuum, current and gas valves
Patented ceramic sealing technology for gas tightness
Large vacuum working chamber for more even deposition
Specifications
Target size: diameter 50mm, thickness 0.12 mm
Vacuum chamber: Diameter 160mm, Height 120mm
Coating area: Diameter 50mm
Vacuum limit: 5 Pa
Maximum current: 50 mA
Timing: <900 seconds
Gas inlet: optional
Maximum voltage: 1600 DCV
Vacuum pump: included, industrial level, inlet and outlet filters included, 2L/min air displacement
All accessories included except target
Plasms Enhanced Atomic Layer Deposition System ALD-MNT100P
Specifications:
Coating area: ? 100mm ,or requested by customers
Substrate temperature: ? 500°C
Thickness uniformity: less than 1% for a 100mm-thick film
Carrier gas: Nitrogen or Argon
Precursor: Optional
Plasma: fast switch-on and switch off, variable output power
Advantages:
Precise thickness control at atomic layer level
Excellent step coverage for materials such nano tube, fiber, pore arrays etc
Optimized designing to protect vacuum-sealing parts
All parts compatible with the requirements of semiconductor industry
Multiple deposition modes to choose for various requirements
Friendly interface for easy operation, all controlled by computer
Plasma pulses to enhance the precursor’s reactivity and minimize the film damage
Lowering the substrate temperature, while improving the film performance
Coating Materials:
Metal:Ru, Pt, W, Ni, Fe, ...
Nitrides:TiN,AlN,Zr3N4,Hf3N4,WN, ...
Oxides:HfO2,SiO2,ZnO,ZrO2,TiO2,Al2O3,La2O3,B2O3,Gd2O3, ...
Compounds:SrTiO3,BaxSr1-xTiO3(BST),PbZrxTi1-xO3(PZT),YBa2Cu3O7(YBCO),ITO, ...
Screen Printing Coater (CIT-SPC-S3024)
Specifications
Structure: Steel
Printing Top: Stainless steel
Frame Size: 24x30cm (9.5x12inch)
Feathers: Easy operation, simple assembling
Accessories: Aluminum frame, brush, screen 250mesh
Benchtop Sputter Coating System BSC-ETD2000C with Carbon Evap.
Feathers
Compact designing, benchtop sputtering system
Easy to read vacuum and current meters
Automatic controlling of vacuum, current and gas valves
Patented ceramic sealing technology for gas tightness
Large vacuum working chamber for more even deposition
Additional device for carbon deposition through heated evaporation
Specifications
Target size: diameter 50mm, thickness 0.12 mm
Vacuum chamber: Diameter 160mm, Height 120mm
Coating area: Diameter 50mm
Vacuum limit: 5-40 Pa
Maximum current: 50 mA
Timing: <9999 seconds
Gas inlet: optional
Maximum voltage: 1600 DCV for sputtering
Carbon Heating Current: 0-10V (AC)
Vacuum pump: industrial level, inlet and outlet filters included,included, 2L/min air displacement
All accessories included except target
Benchtop Sputter Coating System BSC-ETD2000III (3-Layer Depos.)
Feathers
Compact designing, benchtop sputtering system
Easy to read vacuum and current meters
Automatic controlling of vacuum, current and gas valves
Patented ceramic sealing technology for gas tightness
Large vacuum working chamber for more even deposition
Three sputtering targets and rotating sample holder, capability of depositing 3-layer film
Specifications
Target size: diameter 50mm, thickness 0.12 mm
Vacuum chamber: Diameter 160mm, Height 120mm
Coating area: Diameter 50mm
Vacuum limit: 5 Pa
Maximum current: 50 mA
Timing: <900 seconds
Gas inlet: optional
Maximum voltage: 1600 DCV
Vacuum pump: included, industrial level, inlet and outlet filters included, 2L/min air displacement
All accessories included except target
Benchtop Sputter Coating System BSC-ETD3000
Feathers
Compact designing, benchtop sputtering system
Easy to read vacuum and current meters
Automatic controlling of vacuum, current and gas valves
Patented ceramic sealing technology for gas tightness
Large vacuum working chamber for more even deposition
Specifications
Target size: diameter 50mm, thickness 0.12 mm
Vacuum chamber: Diameter 160mm, Height 120mm
Coating area: Diameter 50mm
Vacuum limit: 5 Pa
Maximum current: 100 mA
Timing: <900 seconds
Gas inlet: optional
Maximum voltage: 3000 DCV
Vacuum pump: included, industrial level, inlet and outlet filters included, 2L/min air displacement
All accessories included except target